1. An tsara wannan kayan aiki na musamman don samar da inlays na RFID da haɗin guntu. Ya fi dacewa don haɗa samfuran da ke da eriya mara haske ko rabin haske (kamar eriya ta PET mai takarda ko mara haske).
2. Ta amfani da tsarin gane gani mai zurfi, injin yana gano ƙananan guntu-guntu daidai - waɗanda aka kawo a cikin tire - da kuma eriya masu sassauƙa; daga baya, masu kunna sauti masu sauri da daidaito suna aiwatar da haɗin guntu da eriya daidai.
| # | Sigogi | darajar |
|---|---|---|
| 1 | Girma | L6000*W1300*H1750 (mm) |
| 2 | Nauyi | Kimanin 2000 KG |
| 3 | Ƙarfin wutar lantarki mai ƙima | Mataki na Uku, AC380V |
| 4 | Ƙarfin da aka ƙima | Kimanin 16 KW |
| 5 | Matsi na Iska | 0.6 ~ 0.8 MPa |
| 6 | Amfani da Iska | Kimanin lita 100/MIN |
| 7 | Lambar Mai Aiki | Mutum 1 |
| 8 | Nau'in Sarrafawa | PC |
| 9 | Tsarin Aiki | Nasara 10 |
| 10 | UPH | Girman 25mm: guda 15000/h |
| Fitilar 50mm: 7500 ~ guda 8000/h | ||
| Fitilar 150mm: guda 2600/h | ||
| 11 | yawa | 99.70% |
| 12 | Hayaniya | ≤85 DB |
| 13 | Die Haɗa Daidaito | ±0.05 mm |
| 14 | Kayan Aikace-aikace | Busasshen inlay guda ɗaya |
| 15 | Substrate | PET, takarda; kauri: ≥0.05 mm |
| 16 | Canji Akan Lokaci — Cikakken Canjin Samfura (eriya da guntu da kuma wataƙila ACP/NCP) | Kimanin mintuna 150 |
| 17 | Sauyawar Lokaci — Wafer/Chip Kawai | Minti 5 |