• RFID

Kayan Aikin Samar da RFID

  • Lakabin RFID Reel Label UV Bugawa, Karatu da Shigar da Lakabi, Gano Injin Samfurin: YMJ-LP30

    Lakabin RFID Reel Label UV Bugawa, Karatu da Shigar da Lakabi, Gano Injin Samfurin: YMJ-LP30

    Bayanin Gabaɗaya

    Na'urar Bugawa ta UV, Rubutawa da Ganowa ta RFID Reel Label kayan aikin gano bayanai ne na inkjet + na'urar gano bayanai; An tsara ta musamman don bugawa mai sauri, karantawa, coding da gano samfuran lakabin lantarki na jere ɗaya-da-biyu. Dangane da buƙatun samarwa, wannan na'urar ta haɗa da ayyuka masu zuwa:

    • Aikin saita alamar;
    • Ci gaba da mummunan lakabi, aikin ƙararrawa na saita lakabi mara komai;
    • Aikin gano kayan da ya ɓace;
    • Aikin saitin saurin manufa na samarwa;
  • Na'urar Ganowa ta RFID Tag/Kati Guda ɗaya ta UV Bugawa, Karatu da Rubutu

    Na'urar Ganowa ta RFID Tag/Kati Guda ɗaya ta UV Bugawa, Karatu da Rubutu

    Bayanin Gabaɗaya

    Na'urar Ganowa ta RFID Tag/Kati Guda ɗaya ta UV Bugawa, Karatu da Rubutu
    Samfurin: YMJ-SP120

    Ana amfani da kayan aikin wajen bayar da katin tag guda ɗaya, bugawa, gano karatu da rubutu da kuma tattara kayan da aka gama.

    Ana amfani da tsarin kalmomi bakwai don tattara kayan aiki da kuma rage tsawon sararin.

  • Samfurin Injin Canza RFID: CM75+2

    Samfurin Injin Canza RFID: CM75+2

    Bayanin Gabaɗaya

    Wannan injin injin yanke-yanke ne mai tashoshi biyu (wanda ke ɗauke da sandunan ciyarwa guda biyu) wanda aka sanye shi da na'urorin yanke-yanke guda biyu.

    Tsarin haɗa abubuwa masu aiki da yawa wanda ke da ikon samar da nau'ikan samfuran RFID masu zuwa: alamun RFID masu rauni masu hana jabun kayayyaki, alamun RFID na likitanci, madaurin hannu na RFID, alamun jakunkunan jirgin sama na RFID, alamun rataye tufafin RFID, da alamun mannewa na RFID.

  • Na'urar Haɗa Chip RFID: ST-FC180

    Na'urar Haɗa Chip RFID: ST-FC180

    Bayanin Gabaɗaya

    RFIDSamfurin Injin Haɗa Chip: ST-FC180
    Ana amfani da cikakken injin haɗin guntu na RFID mai atomatik don HFHaɗa guntu na UHF, faɗin yanar gizo na substrate (alkiblar CD) har zuwa 200MM, injin an haɗa shi da eriya, an cire manne, an haɗa shi da matsi, an danna zafi, tabbatar da QC, mummunan inlay disc, da sauransu ayyuka, inci 8 da 12 na wafer disk sun dace, inci 6 na wafer disk yana buƙatarmusammanan yi.